Plating Equipment Product List and Ranking from 6 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Oct 08, 2025～Nov 04, 2025
This ranking is based on the number of page views on our site.

Plating Equipment Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Oct 08, 2025～Nov 04, 2025
This ranking is based on the number of page views on our site.

  1. トーア電子 Aichi//others
  2. 三泉機械工業 Osaka//Other construction industries
  3. ワイケイシー Nagano//others
  4. SETO ENGINEERING 守谷事業所 Ibaraki//Building materials, supplies and fixtures manufacturers
  5. 5 日本プレーテック Tochigi//Service Industry
Go to Company Ranking

Plating Equipment Product ranking

Last Updated： Aggregation Period:Oct 08, 2025～Nov 04, 2025
This ranking is based on the number of page views on our site.

  1. Roll-to-roll (RtoR) plating equipment トーア電子
  2. Carrier transport plating device トーア電子
  3. Sansen Machinery Industry Co., Ltd. Business Introduction 三泉機械工業
  4. Equipment, ancillary devices, construction ワイケイシー
  5. 4 Electrolytic copper plating device (non-dissolving copper plating) SETO ENGINEERING 守谷事業所

Plating Equipment Product List

1～15 item / All 18 items

Displayed results
Electrolytic copper plating device (non-dissolving copper plating)

Electrolytic copper plating device (non-dissolving copper plating)

We would like to introduce a device that performs copper plating treatment on the product pattern section using a vertical transport method.

The device can perform copper plating on the product pattern section. The process involves pre-treatment of the film foil, copper plating, rinsing, and drying, and is carried out in a roll-to-roll vertical transport method for both sides of the product. The reference dimensions of the device, excluding the control panel and ancillary equipment, are 20m (L) × 4.6m (W) × 4.4m (H). 【Specifications】 ■Lane configuration: 1 Lane ■Transport speed: 1.0m/min ■Material width: MAX 300mm ■Material thickness: 25μm to 50μm ■Processing surface: Both sides *For more details, please refer to the PDF document or feel free to contact us.

  • others

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Non-electrolytic copper plating device

Non-electrolytic copper plating device

No scratches or wrinkles during transport! By adopting an UP/DOWN processing method in the processing section, it is possible to shorten the overall length of the device.

The device can perform copper plating on a "conductive ink" pattern formed in a resin film using an electroless method. Thin materials are transported without scratches or wrinkles using our company's transport technology. By adopting an UP/DOWN processing method for the processing section, it is possible to shorten the overall length of the device. 【Specifications】 ■Lane configuration: 1 Lane ■Transport speed: 0.5m/min (Max 1.5m/min) ■Material width: MAX 600mm ■Material thickness: 50μm and above ■Processing surface: Single-sided and double-sided *For more details, please refer to the PDF document or feel free to contact us.

  • others

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
What is roll to roll? ~Plating Edition Part 2~

What is roll to roll? ~Plating Edition Part 2~

We provide an easy-to-understand explanation of the "electrolytic plating" using the roll-to-roll method!

This document introduces the plating process conducted using a roll-to-roll method. There are various methods and types of plating performed using the roll-to-roll technique. Among them, we explain the electrolytic plating. In the section on types of electrolytic plating, we also introduce the features, conditions, and challenges. As mentioned in "Plating Part 1," both electrolytic plating and electroless plating have their own characteristics, so it is necessary to choose a plating method that utilizes these features depending on the product being made. We encourage you to read it. *For more details, please refer to the PDF document or feel free to contact us.

  • others

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Carrier transport plating device

Carrier transport plating device

The substrate is hooked onto a specific jig for plating treatment.

■It can be switched to various processes. ■It is compatible with various metal plating. ■We propose efficient, highly maintainable, and compact equipment. ■It is suitable for processing large substrates and similar items. ■Individual current management for each processing tank or hanging fixture is possible, making it easy to select multiple processing steps. *For more details, please feel free to contact us.*

  • others

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Dissolving copper plating device

Dissolving copper plating device

Semi-additive pattern plating is also possible! We would like to introduce our molten copper plating equipment.

The device can perform electrolytic copper plating on blind vias and through holes. Material thickness ranges from PI 25μm, and material width is up to 540mm. Semi-additive pattern plating is also possible. Additionally, plating for CCL materials is available. Please feel free to consult us. 【Specifications】 ■ Lane configuration: 1 Lane ■ Transport speed: 0.5m to 1.5m/min (depending on specifications) ■ Material width: 540mm ■ Material thickness: PI 25μm and above ■ Processing surface: Both sides (single side or both sides) *For more details, please refer to the PDF document or feel free to contact us.

  • others

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Non-electrolytic tin plating device

Non-electrolytic tin plating device

The transport speed is 2.0m/min, material thickness: compatible with PI 25μm and above! Introducing our electroless tin plating equipment.

This product is a device for electroless tin plating on wiring patterns. The transport speed is 2.0 m/min, and the material width is 35mm to 160mm for TAB/CSP/COF, and 250mm to 300mm for FPC. The device consists of the following processes: unwinding, pretreatment, tin plating, post-treatment/water washing, rinsing, liquid draining, drying, and winding. 【Specifications】 ■ Lane configuration: 2 Lanes ■ Material thickness: PI 25μm and above ■ Processing surface: Single side ■ Utilities: Power supply AC 200V・220V / 50Hz・60Hz, city water, pure water, cooling water, scrubber, heat exhaust, (steam) ■ Dimensions: 38mL × 2.5mW × 2.5mH (approx.) *Control panel and ancillary equipment are separate *For more details, please refer to the PDF document or feel free to contact us.

  • others

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Electrolytic Ni/Au plating device

Electrolytic Ni/Au plating device

The transfer speed is 1.0m to 2.0m/min, and the material thickness is compatible with PI 25μm and above! Introducing our electroplated Ni/Au equipment.

This product is a device for electroplating Ni+Au on wiring patterns. The transport speed is 1.0m to 2.0m/min, and the material width is 35mm to 160mm for TAB/CSP/COF, and 250mm to 300mm for FPC. The device consists of the following processes: unwinding → pre-treatment → Ni plating → Au plating → hot water rinse → water rinse → liquid draining → drying → winding. 【Specifications】 ■ Lane configuration: 2 Lanes ■ Material thickness: PI 25μm and above ■ Processing surface: one side ■ Utilities: Power supply AC 200V・220V / 50Hz・60Hz, city water, pure water, cooling water, scrubber, heat exhaust, (steam) ■ Dimensions: 38mL × 2.5mW × 2.5mH (approx.) *Control panel and ancillary equipment are separate. *For more details, please refer to the PDF document or feel free to contact us.

  • others

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Japan Platech Iron Alloy Plating Equipment (Carrier Type)

Japan Platech Iron Alloy Plating Equipment (Carrier Type)

Patents have been obtained in the USA, EU, and China.

In our workshop, we not only assist everyone with their prototypes but also conduct independent research for development. We look forward to your use of our services.

  • others

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Introduction to Toa Electronics' Wet Process Business

Introduction to Toa Electronics' Wet Process Business

Technological capabilities that contribute to the development and practical application of advanced materials.

We propose a surface treatment device that condenses our unique manufacturing technology. In recent years, with the increasing complexity of three major categories of circuits—flexible printed circuits (FPC), rigid printed circuits, and packages—we handle various surface treatment devices such as plating equipment, developing, etching, and stripping devices (DES), and cleaning equipment that respond to the trends of high density and miniaturization. We accommodate a wide range of wet processes, from subtractive methods (etching) to additive methods (plating), including SAP and MSAP, tailored to customer needs and processes such as substrate material, thickness, effective treatment width, treatment thickness, and transport speed. We will propose the optimal equipment configuration according to the application and processing accuracy. We take full responsibility for the design, manufacturing, assembly, installation, and maintenance of various devices.

  • others

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Roll-to-roll (RtoR) plating equipment

Roll-to-roll (RtoR) plating equipment

Stable transport is possible with EPC! Introducing plating equipment compatible with both thick film and thin film applications!

This product minimizes the installation space of the equipment for vertically transporting substrate film. EPC (Edge Position Sensors) are placed at various points of the equipment. It achieves stable transport capability without meandering while transporting the substrate vertically. The film can be continuously plated using a roll-to-roll (RtoR) method, and it supports various plating types such as Cu, Ni, Au, and Sn, suitable for both thick and thin films. 【Features】 ■ Continuous plating of film using roll-to-roll (RtoR) method ■ Space-saving design ■ Stable transport with EPC *For more details, please feel free to contact us.

  • others

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Uniform work efficiency and product quality 【Overhead traveling fully automated system】

Uniform work efficiency and product quality 【Overhead traveling fully automated system】

Supports various plating processes! By implementing a production management system, you can manage various data.

Our company's "Ceiling-Mounted Fully Automatic Device" can easily accommodate fluctuations in processing volume, regardless of the size of the products, and has a wide range of applications for various plating processes. As a safety measure, sensors are installed in various locations to prevent collisions, double feeding, overruns, and other issues. Additionally, by implementing a production management system to ensure consistent work efficiency and product quality, we can manage various data (processing time, current value, temperature, oscillation count, oscillation speed, and more upon consultation). [Features] - High-speed operation is possible by changing the program. - Cycle time can be reduced. - Lot tracking is possible in case of abnormalities. - Compatible with various plating processes. - Various data can be managed through the introduction of a production management system. *For more details, please refer to the PDF document or feel free to contact us.

  • Facility Design
  • others

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Sansen Machinery Industry Co., Ltd. Business Introduction

Sansen Machinery Industry Co., Ltd. Business Introduction

Proactively research and develop new technologies that are friendly to people and the Earth!

Our company mainly manufactures metal surface treatment equipment and environmental protection devices. Since our establishment, we have always focused on producing user-friendly, reliable, and innovative products, including electroplating equipment, wastewater treatment systems, and other environmental conservation devices. We are also dedicated to water reuse, including ion exchange systems and pure water systems. 【Business Description】 ■Manufacturing of metal surface treatment equipment and environmental protection devices *For more details, please refer to our catalog or feel free to contact us.

  • Metalwork

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Equipment, ancillary devices, construction

Equipment, ancillary devices, construction

We create inspection devices and more from scratch based on your proposals! We fully support your "wants" related to manufacturing.

At YKSC Co., Ltd., we provide a comprehensive service for "equipment, ancillary devices, and construction," including the selection and installation of factory exhaust ducts and scrubbers. We also offer custom proposals and manufacturing of inspection devices tailored to your products. We are committed to fully supporting your manufacturing needs and desires. We respond to diverse needs, so please feel free to contact us when you require our services. 【Features】 ■ Comprehensive support from the selection of factory exhaust ducts and scrubbers to installation ■ Custom proposals and manufacturing of inspection devices tailored to your products ■ Full support for your manufacturing desires *For more details, please refer to the PDF document or feel free to contact us.

  • Safety and consumables
  • Water Treatment
  • Other earthworks, foundation works, and exterior floors

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Japan Platech Zinc Coating Equipment (Pusher Type)

Japan Platech Zinc Coating Equipment (Pusher Type)

Patents have been obtained in the USA, EU, and China.

In the workshop, we not only assist everyone with their prototypes but also conduct independent research for development. We look forward to your use of our services.

  • others

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Japan Playtech Rotary Zinc Coating Device (Pusher Type)

Japan Playtech Rotary Zinc Coating Device (Pusher Type)

Patents have been obtained in the USA, EU, and China.

In our workshop, we not only assist everyone with their prototypes but also conduct independent research for development. We look forward to your use of our services.

  • others

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Search Keywords Related to Plating Equipment

COPYRIGHT © 2001-2025 IPROS CORPORATION ALL RIGHTS RESERVED.